HDI Printed Circuit Board Manufacturing China OEM Factory

Product material: S1000H.

Material TG：TG150

Board type: ML4 board

Min holes: 0.1mm

Min trace width/gap:0.12mm/0.12mm

Min BGA pad size:0.2mm

Finished board thickness: 1.6mm

Solder mask: Glossy green

Silkscreen: white

Surface Treatment: ENIG, RoHS compliant.

Accept Standard: IPC class 3

Special process: blind vias（top-L2, L3-bottom）, Laser drilling. vias filling with copper.