ENIG HDI Printed Circuit Board Application-Specific Integrated Circuit

Product material: IT180A.

Material TG：180

Board type: ML6 board

Min holes: 0.075mm

Min trace width/gap:0.1mm/0.1mm

Min BGA pad size:0.2mm

Finished board thickness: 1.6mm

Solder mask: Glossy green

Silkscreen: white

Surface Treatment: ENIG, RoHS compliant.

Accept Standard: IPC class 3

Special process: buired vias, laser drilling. vias filling with copper.