6 Layer ENIG Blind vias PCB Board

Product material: S1000-2M.

Material TG：170

Board type: ML6 board

Min holes: 0.1mm

Min trace width/gap:0.1mm/0.1mm

Min BGA pad size:0.2mm

Finished board thickness: 1.6mm

Solder mask: Glossy green

Silkscreen: white

Surface Treatment: ENIG, RoHS compliant.

Accept Standard: IPC class 3

Special process: via in pad, edge plating.