Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde
Contact: Michael
Phone: +8615338012748
E-mail: Michael@wydcircuits.com
Add: Address: B2-1, Building B2, WanXia Industrial Park, Tangwei, Fuyong Town, Baoan, Shenzhen, China.
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